MPW Program

MyFab

Vendor Management

Failure Analysis Service

Types of FAS

Destructive

Non-Destructive

Silterra FAS Capabilities

Handling Procedures

FAS Request Form

Photo Mask Service

Failure Analysis Service
Silterra FAS Capabilities     Focus Ion Beam (FIB)   Reactive Ion Etcher (RIE)   Photon Emission Microscopy & Scanning Laser Optical Microscope   TEM   FE - SEM   AFP Nanoprober and Parametric Analyzer Cross sectioning to check for Bond pad structure and Solder bump integrity