MPW Program

MyFab

Vendor Management

Failure Analysis Service

Types of FAS

Destructive

Non-Destructive

Silterra FAS Capabilities

Handling Procedures

FAS Request Form

Photo Mask Service

Failure Analysis Service

Destructive Failure Analysis   FA Technique Applications Focused Ion Beam (FIB) Cross-section, circuit modification, high resolution inspection, Passive Voltage Contrast (PVC); Field-Emission Scanning Electron Microscopy (FE-SEM) High resolution inspection, Passive Voltage Contrast (PVC); Energy Dispersive X-ray Spectometry (EDX) Qualitative and quantitative elemental analysis; Sela Micropoint Cleaving System Micro precision cleaving; Photon Emission Microscopy & Scanning Laser Optical Microscope Fault isolation to determine emission spot; Liquid Crystal Fault isolation to determine emission spot; Scanning Laser Optical Microscope with two EMMI cameras (TIVA) Fault isolation to determine emission spot; AFP Nanoprober + Parametric Analyzer Electrical prober on sub-micron features; IV curve trace, static electrical anaylsis; IC Decapsulator Package IC decapsulation;