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16 Jan 2019
SilTerra Receives IATF 16949:2016 Automotive Certification

SilTerra Malaysia, a leading pure play wafer foundry in Malaysia announced today that it has received the new IATF 16949:2016 Automotive Certification from SGS (Societe Generale de Surveillance), a world leading inspection, verification, testing and certification company with headquaters located at Geneva, Switzerland.

The IATF 16949:2016 was launched in October 2016 to supersede and replace ISO/TS 16949 and it represents an evolution for quality management in the automotive industry. Manufacturers with IATF 16949 certification are recognized for their ability to meet the demands of automotive manufacturing, promising superior process integration, customer confidence, and product performance.

“We are delighted for achieving this key milestone, which demonstrated SilTerra’s organization management system, manufacturing system and process control system are fully complied to International Automotive Quality Management System. Our fabrication processes are ready to manufacture for automotive products which require stringent quality control with extended reliability assurance.” said Firdaus Abdullah, Chief Executive Officer of SilTerra. “With this accomplishment, we can broaden our customer base aggressively by offering our wafer foundry service to automotive product companies.” he added.


About SilTerra:

SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering fabrication and design support services in CMOS logic, High-Voltage, Mixed-signal, RF, BCD, Discrete Power, Silicon Photonics, Life Science and MEMS technologies down to 90 nanometer feature size. SilTerra's wafer fab has a design-in capacity of 46,000 eight-inch wafers per month and currently serves customers in US, Taiwan, Korea and China.

Environmentally vigilant, SilTerra delivers award-winning, world-class performance to its customers seeking flexible capacity, custom technologies, competitive advantages and around the clock customer support. SilTerra is IATF 16949:2016, ISO 9001:2015 and ISO 14001:2015, OHSAS 18001:2007 and IECQ QC 080000:2012 certified Starting commercial production in 2001, the company's headquarters and factory are located in Malaysia's Kulim Hi-Tech Park, with sales and marketing offices in San Jose (California) and Hsinchu (Taiwan).

For additional information on SilTerra or its services, please visit www.silterra.com

Matthew Tan Hooi Sin
Tel: +604-401-5114
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Koh Meng Kong
Tel: +604-401-4166
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05 Dec 2018
IGSS GaN and SilTerra Demonstrate Powerful New Technology to Unlock US$12 Billion Semiconductor Opportunity

Singapore and Kulim, Malaysia, 5 December 2018 - IGSS GaN (IGaN), a Singapore-based specialist in GaN-on-silicon technology, and SilTerra Malaysia Sdn. Bhd., a home-grown Malaysian semiconductor wafer foundry, are pleased to announce the impressive results of their recent technology transfer partnership, successfully demonstrating a breakdown voltage of 650V for a D-Mode MISHEMT device using 200mm GaN-on-Si wafer on CMOS compatible fabrication process. The outcome of this exclusive collaboration results in the transfer and establishment of a gold-free metallization and CMOS compatible 200mm GaN-on-Si Metal-Insulator-Semiconductor High Electron Mobility Transistor (MISHEMT) fabrication process in SilTerra.

"IGaN aims to offer an innovative one-stop solution, providing 100mm to 200mm GaN-on-Si epiwafer and 200mm CMOS friendly GaN fabrication processes. This will enable customers in the power semiconductor community currently offering silicon-based power metal–oxide–semiconductor field-effect transistor (MOSFET) and IGBTs to leapfrog into GaN technology devices, unlocking access to the huge opportunity of the US$12 billion power device market using GaN technology," said Raj Kumar, Chairman & CEO of IGaN.

“We are already engaged in positive discussions with other customers enthusiastic about the potential of our platform, keen to accelerate their access into the rapidly growing GaN market, as our new partnership with SilTerra enables mass production of this powerful new technology in early 2019,” he added.

“We are excited about this achievement to demonstrate D-MISHEMT using a 200mm GaN-on-Si wafer on foundry CMOS process. With our close partnership with IGaN, SilTerra is committed to deliver the best yielding process and capacity assurance to fulfil our mutual customers’ business expectations,” said Firdaus Abdullah, CEO of SilTerra.

GaN devices are used for high power density, wireless power transfer, allowing for higher server power, a capability recently demonstrated with great success at the APEC 2018 conference and exhibition in San Antonio, Texas. Using GaN technology, a density on-board charger (OBC) for electric vehicles delivered a three-fold increase in power density at 4kW per litre, compared to a silicon-based charger at 1.3 kW per litre. Further demonstrations revealed that GaN transistors can enable wireless charging to be increased from 100W to 1.5kW.

This innovative technology unlocks the potential for exciting wireless charging applications far beyond low power applications such as cell phones and laptops. GaN also enables greater energy savings and increased power density in data centres, which significantly reduces OPEX, CAPEX and TCO expenses, with a fifty percent power density increase achievable utilizing the same size power supply.

IGaN and SilTerra are together offering an accelerator to spur the conversion of pure silicon and compound-based technologies into GaN-on-Si. This will favourably impact the bottom line and long-term business competitiveness of both power and RF semiconductor companies who adopt this technology. The powerful efficiency performance figures of GaN-on-Si show its further potential as a green-enabling technology, delivering a positive global environmental impact by minimizing power conversion losses.

For more information on our pioneering semiconductor and fabrication processes and partnerships, please contact us at This email address is being protected from spambots. You need JavaScript enabled to view it.


About IGSS GaN Pte Ltd

IGSS GaN (IGaN) provides a one-stop solution for gallium nitride on silicon (GaN-on-Si) wafer fabrication for power, radio frequency (RF) and sensor devices. We manufacture GaN-on-Si epitaxial wafers and offer proprietary wafer fabrication services on CMOS compatible Fab.The company was founded in Singapore by industry pioneers and veterans with multiple GaN-on-Si technology partners. Apart from its own IPs/know-how, IGaN has exclusivity of A-STAR’s GaN-on-Si IPs.


IGSS GaN Pte Ltd Contact

Paul Chia
Tel: +65-9835-5033
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About SilTerra:

SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering fabrication and design support services in CMOS logic, High-Voltage, Mixed-signal, RF, BCD, Power and MEMS technologies down to 90 nanometer feature size. SilTerra's wafer fab has a design-in capacity of 46,000 eight-inch wafers per month and currently serves customers in US, Taiwan, Korea and China.

For additional information on SilTerra or its services, please visit:

Koh Meng Kong
Tel: +604-401-4166
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.

Matthew Tan
Tel: +604-401-5114
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22 Nov 2018
China's Leading Microelectronics Manufacturer Picks SilTerra As Strategic Partner to Build RM2.9 Billion Plant

Khazanah Nasional-owned Malaysian semiconductor firm in key consultancy role for set up of advanced 8-inch Factory in Beijing and Advanced Process Technology Transfer

Caption: YDME Chief Executive Officer Dr. Huai Yong Ji and SilTerra Malaysia Chief Executive Officer Firdaus Abdullah at the signing ceremony to set up an 8-inch wafer fabrication plant in Beijing worth RM2.9 billion.

Kuala Lumpur, 22 November 2018 – SilTerra Malaysia Sdn Bhd has been selected as a key strategic partner by China’s leading microelectronics producer, Beijing Yandong Microelectronics Co. Ltd. (YDME) to set up an 8-inch wafer fabrication plant in Beijing.

YDME is a subsidiary of Beijing Electronic Holding Company (BEHC), a state-owned high-tech enterprise that has developed into one of China's leading integrated circuit and device manufacturers.

The new YDME fabrication plant, is listed as one of 20 key projects of the Beijing Science and Technology Creation Centre in 2018. It is earmarked to serve as an integrated chip production plant integrating 8-inch chip research and development, manufacturing and packaging.

Since 2016, YDME has engaged SilTerra to provide multi-tier strategic consultancy that includes planning, design and construction of the fabrication plant, setting up of the IT and quality assurance system as well as technology integration.

According to YDME, the upgrade for the new 8-inch fabrication plant is estimated to involve an investment of 4.8 billion yuan (RM2.9 billion). Covering 73,260 square meters, the plant is expected to be in operation by Q1 2019 and estimated to generate a monthly output of 50,000 wafers per month. SilTerra recently completed the training of 81 engineers and managers who are intended for the new plant.

"Almost all of the key staff that will be working at the new YDME plant will go through three months of intensive training at our Kulim plant. It is an honour to be chosen as their strategic consulting partner in this important project.

"It is a testimony to our 20 years of experience and know-how on independently running a fabrication plant and shows that a Malaysian company has been recognised as achieving standards high enough to be consulted on by Chinese companies," said SilTerra Chief Executive Officer Firdaus Abdullah.

"We’re happy to play a role in fulfilling China's chip dream. We will also be transferring SilTerra process IP (intellectual property) to manufacture new chips. This partnership will open up new opportunities for SilTerra to play a more active role in the emerging China market for advanced microelectronics."

YDME Chief Executive Officer Dr Huai Yong Ji said, "We are delighted to partner with SilTerra in this new role as a consulting partner, having worked with them since 2016 on the 8 inch fabrication plant.

"The expansion of our existing capability to the new 8-inch fab using SilTerra's technology is an important component of our growth plans, not only in terms of improving Yandong's overall level of technological innovation, but also in promoting the integrated circuit industry in China and achieving the targeted national output of US$305 billion by 2030."

"In addition, SilTerra has supplied chips to our subsidiary companies utilising Silterra's proprietary process technology in the areas of LCD Drivers, MOSFET, RFLDMOS and BCD. Moving forward we will have more opportunity to collaborate in many areas."

Commenting on SilTerra's future direction, Abdullah said that SilTerra is on track to producing higher valued products and services such as in the areas of life sciences, internet of things (IOT) and automotive.

"To achieve this, SilTerra embarked on an internal transformation process which began a few years ago.

"Externally, we have begun an initiative to build an ecosystem amongst manufacturers and like minded partners to support each other as we collectively develop skills and capability to address emerging markets and develop advanced technology."

"SilTerra is on a path of transformation, and our advisory role in cross border technology transfer is just a start of things to come."

About SilTerra:

SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering fabrication and design support services in CMOS logic, High-Voltage, Mixed-signal, RF, BCD, Power and MEMS technologies down to 90 nanometer feature size. SilTerra's wafer fab has a design-in capacity of 46,000 eight-inch wafers per month and currently serves customers in US, Taiwan, Korea and China.

For additional information on SilTerra or its services, please visit www.silterra.com

About Beijing Yandong Microelectronics Co., Ltd. (YDME)

Beijing Yandong Microelectronics Co., Ltd. (YDME) was founded in 1987, a subsidiary of Beijing Electronic Holding Company. It is a state-owned high-tech enterprise specializing in the design, manufacture and sale of semiconductor chip has developed into a leading domestic analog integrated circuit and discrete device manufacturers. In 2017, BEHC's revenue exceeded 100 billion yuan.

YDME has a 6-inch chip production line with a monthly output of 30,000 pieces and an annual output of 8 billion ultra-small package production line. The chips have been utilised by many notable brands.

On September 27, 2016 the piling ceremony for the 8-inch fab project of Yandong Microelectronics Company was held in Yizhuang, marking the formal start of the project construction. The same day, YDME and Silterra Malaysia signed a cooperation agreement.

05 Nov 2018
Everspin and SilTerra join forces to create new manufacturing center for MRAM

Chandler, AZ, and Kulim, Malaysia. November 5, 2018 – Everspin Technologies, Inc. (NASDAQ: MRAM), the world's leading developer and manufacturer of Magnetoresistive RAM (MRAM), entered into a multi-year partnership with SilTerra, a world-class semiconductor manufacturing services company located in Kulim, Malaysia, to create additional manufacturing capacity for Toggle MRAM products. This partnership is part of a three-way agreement between Everspin, SilTerra and Bosch Sensortec, a licensee of Everspin’s TMR sensor intellectual property.

Through this partnership, Everspin will augment its production capacity to meet growing demand for its Toggle MRAM products in the industrial, computing, medical, and transportation markets, where fast, reliable, non-volatile memory is critical. Initial production is expected to start in calendar year 2020.

Everspin will continue in parallel to operate its manufacturing line for Toggle MRAM and TMR sensor products in Chandler, AZ. That capacity is operated under a cleanroom lease and manufacturing agreement with NXP that currently extends to January of 2021.

"Everspin is proud to partner with Bosch Sensortec and SilTerra in taking this strategic step of creating new manufacturing capacity for our products. Continued expansion in the manufacturing capacity for our Toggle MRAM products is a key pillar of our long term growth strategy" stated Kevin Conley, Everspin's CEO.

"We are excited about the manufacturing partnership with Everspin and Bosch Sensortec. SilTerra is committed to deliver best-in-class manufacturing capacity support and service to ensure rapid ramp up of products to meet market expectations." said Mr. Firdaus Abdullah, SilTerra's CEO.

About Everspin Technologies

Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in the design, volume production and distribution of Magnetoresistive RAM (MRAM) into markets and applications where data persistence, performance, and endurance are paramount. Serving applications across the data center, industrial, and transportation markets, Everspin has built the strongest and fastest-growing foundation of MRAM users in the world.
For more information, visit www.everspin.com

Everspin Contacts:
Charlie Rubin - Story Public Relations 510-908-3356 This email address is being protected from spambots. You need JavaScript enabled to view it.
Leanne K. Sievers - Shelton Group Investor Relations 949-224-3874 This email address is being protected from spambots. You need JavaScript enabled to view it.

About SilTerra:

SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering fabrication and design support services in CMOS logic, High-Voltage, Mixed-signal, RF, BCD, Power and MEMS technologies down to 90 nanometer feature size. SilTerra's wafer fab has a design-in capacity of 46,000 eight-inch wafers per month and currently serves customers in US, Taiwan, Korea and China.

Environmentally vigilant, SilTerra delivers award-winning, world-class performance to its customers seeking flexible capacity, custom technologies, competitive advantages and around the clock customer support. SilTerra is ISO 9001:2008 and ISO 14001 certified. Starting commercial production in 2001, the company's headquarters and factory are located in Malaysia's Kulim Hi-Tech Park, with sales and marketing offices in San Jose (California) and Hsinchu (Taiwan).

For additional information on SilTerra or its services, please visit www.silterra.com

SilTerra Malaysia Sdn Bhd Contact

Koh Meng Kong
Tel: +604-491-0425
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.

25 Jun 2018
SILTERRA unveils "Monolithic PMUT on CMOS" platform for Finger-print sensing and Medical imaging applications

Kulim, Malaysia, June 25th , 2018 – Malaysian based wafer foundry, SilTerra Malaysia Sdn. Bhd., today unveiled a “Piezoelectric Micromachined Ultrasound transducer (PMUT) on CMOS” platform for Finger-print sensing and Medical imaging applications.

This unique process platform offers a truly monolithic solution and integrates the PMUT on the top of the CMOS resulting in a single-chip solution. The PMUT is formed using a CMOS compatible piezoelectric material and surface micro-machining techniques.

Designers can choose any of the SilTerra’s traditional CMOS/BCD/RF/Ultra low power platforms (180nm or 130nm) and build the PMUT on the top of these platforms.

This platform is supported by the relevant CMOS IP and PDK to enable a fully integrated System-On-Chip.

The PDK supports a configurable PMUT cell to address different end market applications such as a 20MHz PMUT cell for finger-print sensing or a 5MHz PMUT cell for medical imaging.

SilTerra’s “PMUT on CMOS” platform is currently available for prototyping.

"We are very pleased to release this innovative process for prototyping. As this process uses most of the standard CMOS process modules, we are confident to achieve manufacturability and defect density levels similar to the traditional CMOS technologies. By offering a truly monolithic solution, we managed to reduce the parasitics significantly and also offer high fill-factors" quoted Arjun Kumar Kantimahanti, Senior Vice President of MEMS & Sensors BU, SilTerra.


To learn more about this platform, please visit:
http://www.silterra.com/index.php/technology/technology#section03

PMUT Images (Top View)

About SilTerra Malaysia Sdn Bhd:

SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering fabrication and design support services in CMOS logic, High-Voltage, Mixed-signal, RF, BCD, Power, Silicon Photonics and MEMS technologies down to 90 nanometer feature size. SilTerra’s wafer fab has a design-in capacity of 46,000 eight-inch wafers per month and currently serves customers in US, Taiwan, Korea and China.

Environmentally vigilant, SilTerra delivers award-winning, world-class performance to its customers seeking flexible capacity, custom technologies, competitive advantages and around the clock customer support. SilTerra is ISO 9001:2008 and ISO 14001 certified. Starting commercial production in 2001, the company’s headquarters and factory are located in Malaysia’s Kulim Hi-Tech Park, with sales and marketing offices in San Jose (California) and Hsinchu (Taiwan).

For additional information on SilTerra or its services, please visit www.silterra.com

SilTerra Malaysia Sdn Bhd Contact

Dr. Mohanraj Soundara Pandian
Tel : +604-401-5819
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Koh Meng Kong
Tel: +604-401-4166
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01 Mar 2018
Chipus to offer Ultra-Low-Power Analog IP Solutions for SilTerra’s IoT Platform

The Malaysian semiconductor wafer foundry and the Brazilian semiconductor IP and IC design services company jointly announced a strategic partnership focusing on IoT solutions.

Malaysian-based wafer foundry SilTerra Malaysia Sdn Bhd (SilTerra) and Brazilian-based Chipus Microeletrônica S.A. (Chipus) have jointly announced a partnership to provide analog IP solutions focusing on the Internet-of-Things (IoT) market for their mutual customers. This announcement marks a significant milestone of the multi-year collaboration between SilTerra and Chipus.

Chipus, expertise in analog IPs and IC design services, targeted at the Ultra-Low-Power (ULP) IoT applications, has been chosen by the foundry as it fits SilTerra’s IoT platform using the 180nm Ultra-Low-Leakage CMOS technology (I18L). The long-term partnership between the companies have brought them together again to deliver focused semiconductor foundry services and IP solutions and take the leading position in the fast growing IoT market.

The IP Portfolio will be validated in silicon throughout 2018 in two phases, with tape-outs in April 2018 and 3rd quarter 2018. Chipus IP list for I18L contains the following blocks:

  • Oscillators
    • True-ULP 32768Hz RTC Oscillator
      High-Performance Low-Power 32768Hz RTC Oscillator
      6MHz (Re-targetable to 1-20MHz / 3.3V or 1.8V) Low-Power Oscillator
  • 12 bit 5MSPS SAR ADC
  • Low-Power 12-bit Resolution Temperature Sensor
  • ULP Power Management Blocks
    • ULP 370nA LDO Regulator 10mA Load
    • ULP 120nA Power-on Reset
    • ULP 75nA 1.24V Bandgap Reference
    • ULP 8nA Current Generator
    • DCDC PFM/PWM High Efficiency Converters (150mA – 500mA Load)
    • Fully Integrated Ultra-Low-Power Management Unit for IoT ASICs (600nA)

These IPs are based on consolidated architectures that are silicon proven and that have been successfully delivered to customers. As the porting process is still on-going, some specifications can be adjusted to address customers' requests.

“Its an honor to strengthen our partnership and continue developing new solutions for our customers along with SilTerra. We are excited to leverage our expertise on ultra-low-power IPs in IoT applications with SilTerra's technology and platform. This is a step forward in our international strategy and company roadmap. It comes in handy to drive our solutions for battery-powered IoT devices and a great opportunity to continue showing why we have been trusted by SilTerra for the last 7 years”, says Murilo Pessatti, Chipus’ CEO.

SilTerra recently announced the release of 180nm Ultra Low Leakage Technology to target at the IoT Sensor Hub applications. The technology is created for customers who need extreme low power and cost effective technology based on SilTerra's mature, proven, high-volume 0.18-micron technology platform to design for the IoT applications such as remote sensors, wearable, smart meters, and low-power embedded systems. The technology offers modular process option such as RFCMOS passive and active devices, as well as embedded Flash memory, which is ideal for single System-On-Chip (SoC) solution for IoT sensor hub IC design.

“With Chipus strong analog design expertise, they have demonstrated excellent time to market track record in delivering IP solutions to serve SilTerra’s customers, particularly in CMOS and BCD technologies. We are excited to work with Chipus and this partnership would enable our mutual customers to experience reduced design risk and shorten time-to-market advantage", said Yit Loong Lai, Executive Vice President of Sales & Marketing of SilTerra.

To strengthen the commitment and support provided by Chipus to its customers that SilTerra has seen throughout the years, the Brazilian company has recently received the ISO 9001:2015 certification that confirms to the market that the company is concerned about delivering their services in a standardized way and, consequently, with the quality expected by the customer.

Please, go to this link to access the more detailed list of IPs and interact with Chipus Team to further discuss about the IP specifications and customization possibilities.

About Chipus

Chipus Microelectronics is a semiconductor company with proven expertise in the development of ultra-low-power, low-voltage, analog and mixed-signal integrated circuits (ICs) and systems on chip (SoCs).

Relying on a strong experience in power management and data converters, the company has more than 200 IP mixed-signal blocks in process nodes from 40nm to 0.35um of various foundries. Since its foundation in 2008, Chipus has provided IC design services in leading edge technologies also, including down to 28nm and 10nm, with firm commitment and flexible client support to customers worldwide (USA and Americas, Europe, and Asia).

Headquartered in Florianópolis, Brazil, Chipus has a US subsidiary in Silicon Valley and sales teams in both USA and Europe.

Assuring quality standards, Chipus is ISO 9001:2015 certified.

For additional information on Chipus or its services, please visit: www.chipus-ip.com

About SilTerra

SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering fabrication and design support services in CMOS logic, High-Voltage, Mixed-signal, RF, BCD, Power and MEMS technologies down to 90 nanometer feature size. SilTerra's wafer fab has a design-in capacity of 46,000 eight-inch wafers per month and currently serves customers in US, Taiwan, Korea and China.

Environmentally vigilant, SilTerra delivers award-winning, world-class performance to its customers seeking flexible capacity, custom technologies, competitive advantages and around the clock customer support. SilTerra is ISO 9001:2008 and ISO 14001 certified. Starting commercial production in 2001, the company's headquarters and factory are located in Malaysia's Kulim Hi-Tech Park, with sales and marketing offices in San Jose (California) and Hsinchu (Taiwan).

For additional information on SilTerra or its services, please visit www.silterra.com


SilTerra Malaysia Sdn Bhd Contact

Koh Meng Kong
Tel: +604-491-0425
Email: This email address is being protected from spambots. You need JavaScript enabled to view it.

Lu Ping Chiang
Tel: +886-3-574-1587
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David Chang
Tel: +1-408-530-0886
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