Silterra’s Fab 1, an award-winning 200mm facility, is designed with a
maximum capacity of 40 thousand wafers per month.
The fab utilizes 100% scanner photolithography equipment and
able to manufacture wafer technology down to 0.13µm process geometry.
This facility is also equipped with SMIF Class 1 mini environment.
Manufacturing operations utilize CIM automation for control of all
process equipment. Each process module has an integral and real-time SPC
feedback system to maintain outstanding process control. As a result, Silterra
is able to deliver high yielding wafers, from prototypes to
volume production.
