Failure Analysis Service
 


Silterra FAS  Tools

 

 

Focus Ion Beam (FIB)

 

Reactive Ion Etcher (RIE)

 

Photon Emission Microscopy & Scanning Laser Optical Microscope

 

TEM

 

FE - SEM

 

AFP Nanoprober and Parametric Analyzer

 

Cross sectioning to check for Bond pad structure and Solder bump integrity

   
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