Silterra targets TM for its next generation chips 

By David Tan
The Star-Business
URL: http://biz.thestar.com.my/news/story.asp?file=/2007/10/2/business/19049466&sec=business
Tuesday, October 2, 2007

PENANG: Silterra Malaysia Sdn Bhd is targeting Telekom Malaysia Bhd (TM) as one of the first few customers for its next generation radio frequency chips. 

Chief executive officer Eg Kah Yee said the company was collaborating with Telekom Research & Development Sdn Bhd (TM R&D) to produce radio frequency chips that were less than 0.13-micron in size using radio frequency complementary metal oxide silicon technology (RF CMOS). 

Silterra currently produces radio frequency chips of 0.18 micron and 0.13 micron in size. 

“RF CMOS technology enables us to produce radio frequency chips cost effectively. 

“Consumer electronic products, using radio frequency chips running on RF CMOS technology, also make it possible for them to be priced competitively,” Eg said after signing a memorandum of understanding (MoU) with TM R&D to collaborate on the design and fabrication of radio frequency chips using RF CMOS technology. Also present was TM R&D chief executive officer Dr Sharuddin Muslimin.

Eg Kah Yee (right) exchanging documents with Dr Sahruddin Muslimin. With them are Silterra vice-president Firdaus Abdullah (second from right) and TM R&D head of basic research Dr Abdul Fatah Awang Mat

Eg said the first batch of radio frequency chips would be out in 12 months, targeted at TM and other multinational telecommunication companies. 

He said the collaboration was an important milestone for Silterra in terms of enhancing cooperation between two government-linked companies to develop core competencies in wafer fabrication and chip design capabilities using leading edge technologies. 

“Silterra has collaborated with higher learning institutions for the past five to six years in various capacities, and is seeing positive results in terms of increasing availability of specific skill sets to better support the front-end activities of the semiconductor industry,” he added. 

Meanwhile, Shahruddin said the MoU provided an opportunity for TM R&D to enhance its capabilities on radio frequency integrated circuits with Silterra’s RF CMOS technology, which was to be used in future wireless local area network applications. 

“This will later meet the growing demand for wireless broadband services in Malaysia,” he said.


About Silterra Malaysia Sdn. Bhd.:

Market demand driven, SilTerra Malaysia Sdn Bhd is a semiconductor wafer foundry offering major foundry compatible CMOS logic, high-voltage and mixed-signal/RF technologies down to 0.13-micron feature size. This includes complete, competitive contract manufacturing for fabless and IDM customers’ designs. SilTerra’s wafer fab has a design capacity of 40,000 eight-inch wafers per month.
Environmentally vigilant, SilTerra delivers award winning, world-class performance to its customers seeking flexible capacity, competitive advantages and around the clock customer support. SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in 1995, the company’s headquarters and factory are located in Malaysia’s Kulim High-Tech Park, and SilTerra has sales and marketing offices in San Jose (California) and Hsinchu (Taiwan). For additional information on SilTerra or its services, please visit www.silterra.com.