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2008
Press Releases
SILTERRA RELEASES PSP COMPACT MOSFET MODEL
Kulim, Kedah, August 22, 2008 – SilTerra Malaysia, a leading RF CMOS technology provider, today announced the release of surface potential based PSP MOSFET model for its 0.13um RFCMOS technology. PSP model has been adopted by the Compact Model Council (CMC) to be the next generation industry standard compact MOSFET model and is accurate across different transistor dimensions as well as operating regions. This is the first time announcement among CMOS pure-play foundries.
The PSP model offers several critical advantages in the modeling of RF devices including accurate modeling of gate leakage current, low and high frequency noise as well as higher order derivatives of current-voltage characteristics where many key performances of RF circuit blocks are sensitive to, i.e., phase noise in Voltage Controlled Oscillator (VCO), output power performance (P1dB), linearity, and harmonic distortion (IP3).
Currently, BSIM3 and BSIM4 MOSFET models are widely used in the industry. However, BSIM3 and BSIM4 models become complex and are difficult to accurately model the behavior of deep submicron MOSFETs, partly, due to the introduction of a large number of empirical fitting parameters. On the other hand, PSP model is physics-based and has comparatively less number of fitting parameters to provide significantly better fit, especially, RF performance, and extendable to deep submicron MOSFET technologies.
Along with the release of PSP MOSFET model, Silterra has been supporting BSIM3 model for 0.18um and 0.13um technologies for our customers, and will support BSIM4 model as well. “All we intend to do is to make sure that we provide a value-added solution to our customers to have seamless success in first-time design and competitive advantage in time to market”, said Dr. Narain Arora, Senior Vice President of Design Technology.
Dr. Arora added, “Silterra is a leading foundry focusing on mixed signal RF market. Our latest 0.13 micron RFCMOS technology is targeting at the advanced wireless or wired applications for the fast expanding wireless LAN, GPS, TV tuners and highly integrated one chip SOC handheld applications. This technology offers a high performance RFCMOS, high-C and high-Q passive component, with full copper backend interconnect. It also features full suite of design kits and libraries to help our customers win early designs with the time-to-market advantage.”
“Being a leader in RF CMOS technology, SilTerra is also on track to roll out its CMOS 90nm in Q209 following by RF design kit completion in Q309. Our latest development of 90nm with 6TSRAM < 1um2, is executing very well and that will allow CMOS backbone capable of doing higher level integration for system-on-chip.” Dr. Arora added.
About
Silterra Malaysia Sdn. Bhd.:
Market demand driven, SilTerra Malaysia Sdn Bhd is a semiconductor
wafer foundry offering major foundry compatible CMOS logic,
high-voltage and mixed-signal/RF technologies down to 0.13-micron
feature size. This includes complete, competitive contract
manufacturing for fabless and IDM customers’ designs. SilTerra’s
wafer fab has a design capacity of 40,000 eight-inch wafers per
month.
Environmentally vigilant, SilTerra delivers award winning,
world-class performance to its customers seeking flexible capacity,
competitive advantages and around the clock customer support.
SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in 1995,
the company’s headquarters and factory are located in Malaysia’s
Kulim High-Tech Park, and SilTerra has sales and marketing offices
in San Jose (California) and Hsinchu (Taiwan). For additional
information on SilTerra or its services, please visit www.silterra.com.
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