Silterra Malaysia Sdn. Bhd. : Wafer Foundry

Types of Failure Analysis Services

Destructive Failure Analysis

FA Technique	Applications
Focused Ion Beam (FIB)	Cross-section, circuit modification, high resolution inspection, Passive Voltage Contrast (PVC);
Field-Emission Scanning Electron Microscopy (FE-SEM)	High resolution inspection, Passive Voltage Contrast (PVC);
Energy Dispersive X-ray Spectometry (FDX)	Qualitative and quantitative elemental analysis;
Sela Micropoint Cleaving System	Micro precision cleaving;
Photon Emission Microscopy & Scanning Laser Optical Microscope	Fault isolation to determine emission spot;
Liquid Crystal	Fault isolation to determine emission spot;
Scanning Laser Optical Microscope with two EMMI cameras (TIVA)	Fault isolation to determine emission spot;
AFP Nanoprober + Parametric Analyzer	Electrical prober on sub-micron features; IV curve trace, static electrical anaylsis;
Reactive Ion Etcher (RIE)	Selective etching or de-layering;
IC Decapsulator	Package IC decapsulation;