Failure Analysis Service
 


Types of Failure Analysis Services

Destructive Failure Analysis

 

FA Technique Applications
Focused Ion Beam (FIB) Cross-section, circuit modification, high resolution inspection, Passive Voltage Contrast (PVC);
Field-Emission Scanning Electron Microscopy (FE-SEM) High resolution inspection, Passive Voltage Contrast (PVC);
Energy Dispersive X-ray Spectometry (FDX) Qualitative and quantitative elemental analysis;
Sela Micropoint Cleaving System Micro precision cleaving;
Photon Emission Microscopy & Scanning Laser Optical Microscope Fault isolation to determine emission spot;
Liquid Crystal Fault isolation to determine emission spot;
Scanning Laser Optical Microscope with two EMMI cameras (TIVA) Fault isolation to determine emission spot;
AFP Nanoprober + Parametric Analyzer Electrical prober on sub-micron features; IV curve trace, static electrical anaylsis;
Reactive Ion Etcher (RIE) Selective etching or de-layering;
IC Decapsulator Package IC decapsulation;
 

 

 

 

 

 

 





 
 

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