2004 Press Releases
SILTERRA PLACES LARGE ORDER WITH APPLIED MATERIALS FOR
COPPER TECHNOLOGIES
Production-Ready Systems to Speed Technology Ramp
Kulim, Malaysia and Santa Clara, Calif., USA (June 29,
2004) – Silterra Malaysia Sdn. Bhd. today announced that
it has placed a large order with Applied Materials for systems
to manufacture 0.13-micron copper-based chips. The order
includes Applied’s dielectric deposition, etch,
barrier/seed, electrochemical plating and chemical mechanical
polishing systems—as well as its defect inspection and SEM/FIB
defect analysis systems.
“After a careful evaluation of available copper tools, we
found that Applied Materials’ systems have the best
capabilities,” said Bruce Gray, chief operating officer and
interim CEO of Silterra. “These production-ready systems
will help us bring our 0.13-micron process technology on line
very quickly.”
As part of the order, Applied Materials, Inc., the leading
supplier of products and services to the global semiconductor
industry, will provide a dedicated team of technical experts
from its product and local support groups to bring up and
qualify the equipment at Silterra. In addition, a
comprehensive training program for Silterra’s engineers will
be conducted at Applied Materials’ facilities.
“We are very pleased that Silterra has selected our systems
for their new copper production line,” said Franz Janker,
senior vice president of Applied Materials. “We will focus
our extensive resources to help Silterra quickly and smoothly
ramp its new technology into volume production. These
multi-generation systems will also provide Silterra with the
extendibility to move to future technologies.”
Equipment installation is scheduled to begin in Q3 2004 with
qualification completed in Q1 2005. Silterra plans to start
pilot production of its 0.13-micron technology by Q2 2005.
About
Silterra Malaysia Sdn. Bhd.:
Market demand driven, SilTerra Malaysia Sdn Bhd is a
semiconductor wafer foundry offering major foundry compatible
CMOS logic, high-voltage and mixed-signal/RF technologies down
to 0.13-micron feature size. This includes complete,
competitive contract manufacturing for fabless and IDM
customers’ designs. SilTerra’s wafer fab has a design
capacity of 40,000 eight-inch wafers per month.
Environmentally
vigilant, SilTerra delivers award winning, world-class
performance to its customers seeking flexible capacity,
competitive advantages and around the clock customer support.
SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in
1995, the company’s headquarters and factory are located in
Malaysia’s Kulim High-Tech Park, and SilTerra has sales and
marketing offices in San Jose (California) and Hsinchu
(Taiwan). For additional information on SilTerra or its
services, please visit www.silterra.com.
Silterra
Contact
Koh Meng Kong
Tel:
+6-012-491-0425 (Cell phone)
Tel:
+604-401-4166 (o)
Email: mengkong_koh@silterra.com
Lu Ping Chiang
Tel : +886-3-574-1587 (o)
Email:
pingchiang_lu@silterra.com
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