2006 Press Releases
SILTERRA INCREASES WAFER FAB PRODUCTION CAPACITY
COMPANY STARTS 0.16-MICRON PRODUCTION RAMP
Kulim, Malaysia (April 11, 2006) – In order to support
increased customer demand, Silterra Malaysia Sdn. Bhd. has
increased production capacity of its manufacturing fab by
twenty percent to 33,500 wafer starts per month. A portion of
the capacity is dedicated to the CL130G 0.13-micron copper
process; the rest is capable of supporting designs at the
0.18- and 0.16-micron technology nodes. The company plans to
complete its Fab 1 expansion to reach 40,000 wafer starts per
month of capacity by the end of 2006.
Bruce Gray, Chief Executive Officer of Silterra, stated: “We
anticipated the increase in customer demand and expanded our
capacity accordingly. Even with the added capacity, our fab
utilization rate is over ninety-five percent right now. Our
plan is to build out the fab to the maximum capacity of 40,000
wafer starts per month with state-of-the-art 0.13-micron
equipment by year end. We are ramping up volume on the
0.16-micron node, which will contribute to our revenue
significantly for the rest of the year. The present
indications are that Silterra’s business level in 2006 will
be considerably above that of 2005.”
Silterra’s CL160G, a cost reduction version of the
company’s high volume CL180G process, provides fifteen to
nineteen percent area advantage to existing 0.18-micron
designs. The linear shrink methodology does not require
customers to redesign their products in order to enjoy the
cost savings. Silterra has ramped up volume production of
several consumer applications in the process.
Most of Silterra’s future fab expansion will be in advanced
copper metallization capacity for its major foundry matched
CL130G process. Volume production is expected to begin later
in 2006.
In addition to the high demand for its logic processes,
Silterra’s high density, high voltage process technologies
are also running at peak capacity. This includes the
company’s advanced CL180H32 0.18-micron 32V process
featuring a very high density four square micron SRAM cell for
high volume mobile handset display driver applications.
About
Silterra Malaysia Sdn. Bhd.:
Market demand driven, SilTerra Malaysia Sdn Bhd is a
semiconductor wafer foundry offering major foundry compatible
CMOS logic, high-voltage and mixed-signal/RF technologies down
to 0.13-micron feature size. This includes complete,
competitive contract manufacturing for fabless and IDM
customers’ designs. SilTerra’s wafer fab has a design
capacity of 40,000 eight-inch wafers per month.
Environmentally
vigilant, SilTerra delivers award winning, world-class
performance to its customers seeking flexible capacity,
competitive advantages and around the clock customer support.
SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in
1995, the company’s headquarters and factory are located in
Malaysia’s Kulim High-Tech Park, and SilTerra has sales and
marketing offices in San Jose (California) and Hsinchu
(Taiwan). For additional information on SilTerra or its
services, please visit www.silterra.com.
Silterra
Contact
Koh Meng Kong
Tel:
+6-012-491-0425 (Cell phone)
Tel:
+604-401-4166 (o)
Email: mengkong_koh@silterra.com
Lu Ping Chiang
Tel : +886-3-574-1587 (o)
Email:
pingchiang_lu@silterra.com
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