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Silterra
targets TM for its next generation chips
By David Tan
The Star-Business
URL: http://biz.thestar.com.my/news/story.asp?file=/2007/10/2/business/19049466&sec=business
Tuesday, October 2, 2007
PENANG: Silterra Malaysia Sdn Bhd is targeting Telekom
Malaysia Bhd (TM) as one of the first few customers for its
next generation radio frequency chips.
Chief executive officer Eg Kah Yee said the company was
collaborating with Telekom Research & Development Sdn Bhd
(TM R&D) to produce radio frequency chips that were less
than 0.13-micron in size using radio frequency complementary
metal oxide silicon technology (RF CMOS).
Silterra currently produces radio frequency chips of 0.18
micron and 0.13 micron in size.
“RF CMOS technology enables us to produce radio frequency
chips cost effectively.
“Consumer electronic products, using radio frequency chips
running on RF CMOS technology, also make it possible for them
to be priced competitively,” Eg said after signing a
memorandum of understanding (MoU) with TM R&D to
collaborate on the design and fabrication of radio frequency
chips using RF CMOS technology. Also present was TM R&D
chief executive officer Dr Sharuddin Muslimin.
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Eg Kah Yee (right) exchanging documents with Dr
Sahruddin Muslimin. With them are Silterra
vice-president Firdaus Abdullah (second from right)
and TM R&D head of basic research Dr Abdul Fatah
Awang Mat
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Eg said the first batch of radio frequency chips would be out
in 12 months, targeted at TM and other multinational
telecommunication companies.
He said the collaboration was an important milestone for
Silterra in terms of enhancing cooperation between two
government-linked companies to develop core competencies in
wafer fabrication and chip design capabilities using leading
edge technologies.
“Silterra has collaborated with higher learning institutions
for the past five to six years in various capacities, and is
seeing positive results in terms of increasing availability of
specific skill sets to better support the front-end activities
of the semiconductor industry,” he added.
Meanwhile, Shahruddin said the MoU provided an opportunity for
TM R&D to enhance its capabilities on radio frequency
integrated circuits with Silterra’s RF CMOS technology,
which was to be used in future wireless local area network
applications.
“This will later meet the growing demand for wireless
broadband services in Malaysia,” he said.
About Silterra Malaysia Sdn. Bhd.:
Market demand driven, SilTerra Malaysia Sdn Bhd is a
semiconductor wafer foundry offering major foundry compatible
CMOS logic, high-voltage and mixed-signal/RF technologies down
to 0.13-micron feature size. This includes complete,
competitive contract manufacturing for fabless and IDM
customers’ designs. SilTerra’s wafer fab has a design
capacity of 40,000 eight-inch wafers per month.
Environmentally
vigilant, SilTerra delivers award winning, world-class
performance to its customers seeking flexible capacity,
competitive advantages and around the clock customer support.
SilTerra is ISO 9001:2000 and ISO 14001 certified. Founded in
1995, the company’s headquarters and factory are located in
Malaysia’s Kulim High-Tech Park, and SilTerra has sales and
marketing offices in San Jose (California) and Hsinchu
(Taiwan). For additional information on SilTerra or its
services, please visit www.silterra.com.
Silterra
Contact
Koh Meng Kong
Tel:
+6-012-491-0425 (Cell phone)
Tel:
+604-401-4166 (o)
Email: mengkong_koh@silterra.com
Lu Ping Chiang
Tel : +886-3-574-1587 (o)
Email:
pingchiang_lu@silterra.com
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