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| Silterra.com /
Technology |
CL180H5
Key Process Features:
- Supports 1.8V and 5V power supplies
- Single poly, up to six metal layers
- Shallow trench isolation
- Four retrograde wells
- Dual gate oxide
- Surface channel NMOS and PMOS
- Cobalt silicided source, drain and gate
- High density plasma gap fill
- MiM capacitor (optional)
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Key Design Rules:
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Pitch |
| Active |
0.50µm |
| Poly |
0.43µm |
| Metal 1 |
0.46µm |
| Metal 2 - 5 |
0.56µm |
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Top Metal |
0.90µm |
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Key Performance Parameters:
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1.8V Thin Gate |
5V Thick Gate
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NMOS |
PMOS |
NMOS |
PMOS |
| VT |
0.56V |
-0.61V |
0.83V |
-0.82V |
| IDsat |
500µA/µm |
-170µA/µm |
550µA/µm |
255µA/µm |
| RO Delay |
42ps |
N/A |
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Please contact us for detailed technical information.
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