Silterra.com / Technology



CL180H5

Key Process Features:

  • Supports 1.8V and 5V power supplies
  • Single poly, up to six metal layers
  • Shallow trench isolation
  • Four retrograde wells
  • Dual gate oxide
  • Surface channel NMOS and PMOS
  • Cobalt silicided source, drain and gate
  • High density plasma gap fill
  • MiM capacitor (optional)

Key Design Rules:
 
  Pitch
Active 0.50µm
Poly 0.43µm
Metal 1 0.46µm
Metal 2 - 5 0.56µm
Top Metal 0.90µm

Key Performance Parameters:
 
  1.8V Thin Gate 5V Thick Gate
 

NMOS

PMOS

NMOS

PMOS
VT

0.56V

-0.61V

0.83V

-0.82V

IDsat 500µA/µm -170µA/µm 550µA/µm 255µA/µm
RO Delay  42ps N/A


Please contact us for detailed technical information.