Silterra Technology Overview

Silterra’s CMOS Logic process technologies are process-matched to the leading foundry. They provide an excellent combination of power, density and speed specifically to meet the stringent product requirements in Computation, Consumer and Communication electronics applications. We have shipped more than hundred of thousand wafers to our customers using our mainstream 0.13µm, 0.18µm and 0.22µm technology.

Silterra’s 0.18µm Mixed-Signal/Analog and RFCMOS technology are built modularly on top of our proven CMOS Logic process. Our analog component features high precision MiM, finger capacitor, multi Vt option, Deep Nwell and high precision resistor. Our RF component features high precision varactor and thick metal inductor. The Mixed-Signal/Analog and RF modules are specifically designed to serve Analog and wireless application such as WLAN, Zigbee, RFID and Bluetooth.

Silterra’s 0.18µm and 0.22µm High Voltage technology are well positioned to address Flat Panel Display Driver & Power Management IC product requirements. Our proven High Voltage process technologies enabled highly integrated semiconductor product for the competitive end market applications.