CMOS LOGIC – CL150G
CL150G Key Process Features
- Single-poly and up to six metal layers
- Dual gate: 1.8V core, 3.3V I/O
- Cobalt silicided source, drain and gate
- Shallow trench isolation
- Super steep retrograde twin well
- Aluminum metalization with tungsten plug
- FSG inter-metal dielectric
- Metal-Insulator-Metal (MIM) Capacitor (Option)
- Post shrink SRAM bit cell: 3.35µm2
Physical Design Rules
| Parameter | Unit | C18G Pitch | C15G Pitch (after shrink) |
| Active | μm | 0.50 | 0.42 |
| Poly | μm | 0.43 | 0.35 |
| Contact | μm | 0.47 | 0.395 |
| Metal 1 | μm | 0.46 | 0.386 |
| Via 1 | μm | 0.52 | 0.436 |
| Metal X | μm | 0.56 | 0.47 |
| Via X | μm | 0.52 | 0.436 |
| Via Top | μm | 0.71 | 0.596 |
| Metal Top | μm | 0.90 | 0.756 |
Electrical Design Rules
| Parameter | Unit | 1.8V Thin Gate |
3.3V Thick Gate |
| Vtn_lin | V | 0.42 | 0.67 |
| Vtp_lin | V | -0.49 | -0.68 |
| ldsn | μA/μm | 620 | 620 |
| ldsp | μA/μm | 270 | 310 |
| loff | pA/μm | <500 | <100 |
Foundation IP
| IP Name | Vendor | Available |
| Std Cell SC9 RVt | ARM | Now |
| Std Cell SC7 RVt | ARM | Now |
| Memory Compilers | ARM | Now |
| OTP | Ememory | Now |
| MTP | ACTT | Now |
