CMOS LOGIC – CL180G eFlash
Embedded Flash Technology – CL180G eFlash
- Single-poly and up to six metal layers
- Dual gate: 1.8V core and 3.3V I/O
- Supports SuperFlash embedded NOR flash module
- Cobalt silicided source, drain and gate
- Shallow trench isolation
- Aluminum metallization with tungsten plug
- FSG inter-metal dielectric
- Metal-Insulator-Metal (MIM) Capacitor (Option)
- Custom made Flash macro configuration
- SRAM bit cell: 4.65µm2
Physical Design Rules
Parameter | Unit | 1.8V Pitch | 3.3V Pitch |
Active | μm | 0.50 | 0.50 |
Poly | μm | 0.43 | 0.59 (NMOS) 0.55 (PMOS) |
Contact | μm | 0.47 | 0.47 |
Metal 1 | μm | 0.46 | 0.46 |
Via 1 | μm | 0.52 | 0.52 |
Metal X | μm | 0.56 | 0.56 |
Via X | μm | 0.52 | 0.52 |
Via Top | μm | 0.71 | 0.71 |
Metal Top | μm | 0.90 | 0.90 |
Electrical Design Rules
Parameter | Unit | 1.8V Thin Gate |
3.3V Thick Gate |
Vtn_lin | V | 0.42 | 0.71 |
Vtp_lin | V | -0.48 | -0.68 |
ldsn | μA/μm | 600 | 620 |
ldsp | μA/μm | 260 | 300 |
loff | pA/μm | <500 | <100 |
Foundation IP
IP Name | Vendor | Available |
Std Cell SC9 RVt | ARM | Now |
Std Cell SC7 RVt | ARM | Now |
Memory Compilers | ARM/Synopsys | Now |
GPIO | ARM | Now |
Embedded Flash | SST | Now |