MEMS Specialty Tools
Complemented by the state of the art CMOS facilities, the below set of tools are instrumental in fabricating surface micro machined MEMS devices.
MEMS Specialty Tools
Specialty tools | Material | Applications |
Physical Vapor Deposition (PVD) | Aluminum nitride, aluminum scandium nitride, molybdenum | Piezoelectric structural layer |
Low Temperature Physical Vapor Deposition (LT-PVD) |
Amorphous silicon, aluminum,titanium, titanium aluminum alloy |
Structural layer for polymer-based sacrificial layers |
Low Temperature Plasma Enhanced Chemical Vapor Deposition (LT-PECVD) |
Amorphous silicon |
Structural layer for polymer-based sacrificial layers |
Plasma Enhanced Chemical Vapor Deposition (PECVD) | Amorphous silicon (phosphorus-doped), carbon rich amorphous silicon | Structural layer |
Spin Coating / Annealing | Polymer thickness up to 20um / UV cure | Sacrificial layer |
Atomic Layer Depostion | Aluminium Oxide (Al2O3) | Dielectric layer |
Low Temperature Asher | Polymer | Isotropic release process |
Deep Reactive Ion Etch (DRIE) | Silicon | Deep silicon etch |
XeF2 Etch | Silicon, Molybdenum, Tungsten | Isotropic release process |
Front to Back Aligner | Litho tool resist up to 20um | To align the front to the back of the wafer; bulk micromachining |
Electrostatic Temporary Bonder | Handling of thin wafers down to 400um | Electrostatic substrate handling system for thin wafers |
Low Pressure Chemical Vapor Deposition Low Stress Nitride (LPCVD-LSN) | Silicon nitride | Structural layer |
Low Stress Doped Polysilicon Deposition | Doped polysilicon | Structural layer |