MEMS Specialty Tools

Complemented by the state of the art CMOS facilities, the below set of tools are instrumental in fabricating surface micro machined MEMS devices.

MEMS Specialty Tools

Specialty tools Material Applications
Physical Vapor Deposition (PVD) Aluminum nitride, aluminum scandium nitride, molybdenum Piezoelectric structural layer
Low Temperature Physical Vapor Deposition (LT-PVD)

Amorphous  silicon, aluminum,titanium,  titanium aluminum alloy

Structural layer for polymer-based sacrificial layers
Low Temperature Plasma Enhanced Chemical Vapor Deposition (LT-PECVD)

Amorphous silicon

Structural layer for polymer-based sacrificial layers
Plasma Enhanced Chemical Vapor Deposition (PECVD) Amorphous silicon (phosphorus-doped), carbon rich amorphous silicon Structural layer
Spin Coating / Annealing Polymer thickness up to 20um / UV cure Sacrificial layer
Atomic Layer Depostion Aluminium Oxide (Al2O3) Dielectric layer
Low Temperature Asher Polymer Isotropic release process
Deep Reactive Ion Etch (DRIE) Silicon Deep silicon etch
XeF2 Etch Silicon, Molybdenum, Tungsten Isotropic release process
Front to Back Aligner Litho tool resist up to 20um To align the front to the back of the wafer; bulk micromachining
Electrostatic Temporary Bonder Handling of thin wafers down to 400um Electrostatic substrate handling system for thin wafers
Low Pressure Chemical Vapor Deposition Low Stress Nitride (LPCVD-LSN) Silicon nitride Structural layer
Low Stress Doped Polysilicon Deposition Doped polysilicon Structural layer