MEMS Specialty Tools
Complemented by the state of the art CMOS facilities, the below set of tools are instrumental in fabricating surface micro machined MEMS devices.
MEMS Specialty Tools
| Specialty tools | Material | Applications |
| Physical Vapor Deposition (PVD) | Aluminum nitride, aluminum scandium nitride, molybdenum | Piezoelectric structural layer |
| Low Temperature Physical Vapor Deposition (LT-PVD) |
Amorphous silicon, aluminum,titanium, titanium aluminum alloy |
Structural layer for polymer-based sacrificial layers |
| Low Temperature Plasma Enhanced Chemical Vapor Deposition (LT-PECVD) |
Amorphous silicon |
Structural layer for polymer-based sacrificial layers |
| Plasma Enhanced Chemical Vapor Deposition (PECVD) | Amorphous silicon (phosphorus-doped), carbon rich amorphous silicon | Structural layer |
| Spin Coating / Annealing | Polymer thickness up to 20um / UV cure | Sacrificial layer |
| Atomic Layer Depostion | Aluminium Oxide (Al2O3) | Dielectric layer |
| Low Temperature Asher | Polymer | Isotropic release process |
| Deep Reactive Ion Etch (DRIE) | Silicon | Deep silicon etch |
| XeF2 Etch | Silicon, Molybdenum, Tungsten | Isotropic release process |
| Front to Back Aligner | Litho tool resist up to 20um | To align the front to the back of the wafer; bulk micromachining |
| Electrostatic Temporary Bonder | Handling of thin wafers down to 400um | Electrostatic substrate handling system for thin wafers |
| Low Pressure Chemical Vapor Deposition Low Stress Nitride (LPCVD-LSN) | Silicon nitride | Structural layer |
| Low Stress Doped Polysilicon Deposition | Doped polysilicon | Structural layer |
