Piezoelectric Bulk Acoustic Wave
MEMS Process Platform (BAW)
BAW MEMS Key Features
- Aluminum Nitride based BAW devie integrated over CMOS
- Resonant Frequency >2.4GHz
- Achieved maximum acoustic velocity of 10500m/sec.
- 7 additional mask layers to implement this on the top of the traditional CMOS devices.
- Demonstrated TCF of <-30ppm/degC.
- Lower insertion losses compared to SAW and ESR.