MPW Program

SilTerra's Multi Project Wafer (MPW) program is a cost-effective, multi-project design and IP verification service for Customers and IP providers.

This is a program which runs regularly. The program enables multiple customers to participate while sharing mask costs.

The tentative tape-out schedule is shown as below:

1Q2022 -  4Q2023 MPW Schedule

- The above schedule is subject to change
- The final GDS database for C18 BCD and eFlash design to be submitted ONE WEEK before the shuttle closing date



Failure Analysis Service

  • SilTerra's Failure Analysis Service (FAS) offers a comprehensive defect analysis of failure mechanisms for semiconductor integrated circuits ("IC"). Our FA laboratory is equipped with state-of-the-art Failure Analysis Equipment to deliver highly accurate and precise analysis reports for our customers. Our experienced failure analysts apply industry-recognized FA methodology while performing analysis on customer samples. SilTerra’s FAS is open 24x7, 365 days a year as we are committed to meet our customers’ needs in Failure Analysis.

  • FA Technique Applications
    Focused Ion Beam (FIB) Cross-section, circuit modification, high resolution inspection, Passive Voltage Contrast (PVC);
    Field-Emission Scanning Electron Microscopy (FE-SEM) High resolution inspection, Passive Voltage Contrast (PVC);
    Energy Dispersive X-ray Spectometry (EDX) Qualitative and quantitative elemental analysis;
    Sela Micropoint Cleaving System Micro precision cleaving;
    Scanning Laser Optical microscope (InGaAs, VBA, Thermal) Fault isolation to determine emission spot;
    Liquid Crystal Fault isolation to determine emission spot;
    AFP Nanoprober + Parametric Analyzer Electrical prober on sub-micron features; IV curve trace, static electrical anaylsis;
    IC Decapsulator Package IC decapsulation;
  • FA Technique Applications
    Electrical Parametric Analysis Validate functionality of DC performance of IC;
    Bitmap Engineering + Auto Prober Test for bitmapping to locate failed bit location;
    Optical / UV Microscopy High magnification inspection up to 1,500x;
  • SilTerra FAS Capabilities

    Advance SEM for Sub-micron IC microstructure, typography & chemical composition analysis

    Focus Ion Beam (FIB)

    Advance FIB for Voltage Contrast, Micro-X-section image and composition for defect, particle, structure etc.

    Photon Emission Microscopy & Scanning Laser Optical Microscope


    Hot Spot found from EMMI analysis


    TEM Scanning - Planar View and X-section for Ultra High Magnification

    FE - SEM

    SEM Scanning - Voltage Contrast and X-section for Ultra HIgh Magnification

    AFP Nanoprober and Parametric Analyzer

     Nano probing on SRAM failed Bit and IV Parametric Measurement 

    Cross sectioning to check for Bond pad structure and Solder bump integrity
  • Handling Procedures



Photo Mask Service

SilTerra partners with third party photo mask vendors to offer seamless mask-making services. Our photo mask partners are prudently selected through rigorous product and process qualifications, data checks and inline monitoring to ensure the highest quality in our mask services.

SilTerra’s mask service qualification covers accurate GDS file processing, precise mask data preparation, OPC conversion validation and zero-defect mask manufacturing prior to the delivery of these photo masks to SilTerra for wafer production.

With stringent photo mask qualification procedures in place, SilTerra is able to ensure that the photo masks shipped to the fab are accurately matched and optimized for SilTerra’s process capabilities, which will in turn ensure repetitive high wafer yield for our customers’ products.

Below are SilTerra’s qualified Photo Mask vendors:


Wafer Thin-Film Coating Service

SilTerra offers several types of thin-film material coating services on  8" silicon wafer substrates. This service enables Semiconductor Equipment Suppliers, IC packaging and assembly houses and universities to perform thin-film material evaluation on their tools. SilTerra also offers  Probe Card wafer services to customers/assembly houses for bond pad calibration in IC wire-bonders.

Metallic Thin-Film Materials :
Al, Cu + Cap layer, TiN, Ti, W, Cobalt, TiAlN, AlN, Moli, Ta and TaN.

Non-Metallic Thin-Film Materials :
Oxide, SiO2, SiN, TEOS, FSG, USG, BPSG.

Vendor Management 

My Vendor Portal

My Vendor Portal provides SilTerra's approved vendors a "one-stop" secure online access to submit vendor quality-related records such as CA/COC certification, Quality Reports and Others. It also enables vendors to access SilTerra's specs, review revision notifications and provide updates for 8D report (SCAR) corrective actions.

Note: SilTerra will only issue a login access to vendors that are required to perform the above-mentioned tasks. A SilTerra personnel will be in touch with the respective vendor to communicate the login details.

Vendor Management 

Online Pickup Order (ePOF)

This is an online system to facilitate Online Pickup Order Form (ePOF).

Once the registration form is submitted, it is subjected to review and approval prior to be qualified by SilTerra Shipping Department.