Specialty tools | Material | Applications |
Physical Vapor Deposition (PVD) | Aluminum nitride, aluminum scandium nitride, molybdenum | Piezoelectric structural layer |
Low Temperature Physical Vapor Deposition (LT-PVD) | Amorphous silicon, aluminum,titanium, titanium aluminum alloy | Structural layer for polymer-based sacrificial layers |
Low Temperature Plasma Enhanced Chemical Vapor Deposition (LT-PECVD) | Amorphous silicon | Structural layer for polymer-based sacrificial layers |
Plasma Enhanced Chemical Vapor Deposition (PECVD) | Amorphous silicon (phosphorus-doped), carbon rich amorphous silicon | Structural layer |
Spin Coating / Annealing | Polymer thickness up to 20um / UV cure | Sacrificial layer |
Atomic Layer Depostion | Aluminium Oxide (Al2O3) | Dielectric layer |
Low Temperature Asher | Polymer | Isotropic release process |
Deep Reactive Ion Etch (DRIE) | Silicon | Deep silicon etch |
XeF2 Etch | Silicon, Molybdenum, Tungsten | Isotropic release process |
Front to Back Aligner | Litho tool resist up to 20um | To align the front to the back of the wafer; bulk micromachining |
Electrostatic Temporary Bonder | Handling of thin wafers down to 400um | Electrostatic substrate handling system for thin wafers |
Low Pressure Chemical Vapor Deposition Low Stress Nitride (LPCVD-LSN) | Silicon nitride | Structural layer |
Low Stress Doped Polysilicon Deposition | Doped polysilicon | Structural layer |
© 2024 Copyright SilTerra Malaysia | All rights reserved. Trademarks and brands are the property of their respective owners.