IoT Technology – I11L

I11L eFlash Key Process Features

  • Ultra low leakage technology
  • Single-poly and up to six metal layers
  • Dual gate: 1.5V core and 3.3V I/O
  • 3 flavours of LV devices (ULL, LP, HP) offered
  • Supports SuperFlash embedded NOR flash module
  • Cobalt silicided source, drain and gate
  • Shallow trench isolation
  • Aluminum metallization with tungsten plug
  • FSG inter-metal dielectric
  • Metal-Insulator-Metal (MIM) Capacitor (Option)
  • NVM Option: OTP and MTP
  • SRAM bit cell: 1.65µm2

Physical Design Rules

Parameter Unit 1.5V Pitch 3.3V Pitch
Active μm 0.325 0.325
Poly μm 0.28 0.514
Contact μm 0.306 0.306
Metal 1 μm 0.316 0.316
Via 1 μm 0.369 0.369
Metal X μm 0.37 0.37
Via X μm 0.369 0.369
Via Top μm 0.639 0.639
Metal Top μm 0.738 0.738

Electrical Design Rules

1.5V Core Parameter Unit ULL 10 x 0.13 LL 10 x 0.13 HP 10 x 0.13
NMOS VTN_LIN V 0.66 0.51 0.49
DN μA/μm 370 530 590
IOFFN (typical) pA/μm 0.3 8 25
PMOS VTN_LIN V 0.68 0.57 0.55
IDP μA/μm 145 210 230
IOFFP (typical) pA/μm 0.3 2.5 6

Foundation IP

IP Name Vendor Available
Std Cell SC6 RVt ULL VeriSilicon Now
Memory Compilers VeriSilicon Now
GPIO VeriSilicon Now
OTP CFX 2Q19
MTP CMT 2Q19
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