MEMS Specialty Tools

Complemented by the state of the art CMOS facilities, the below set of tools are instrumental in fabricating surface micro machined MEMS devices.

Specialty tools	Material	Applications
Physical Vapor Deposition (PVD)	Aluminum nitride, aluminum scandium nitride, molybdenum	Piezoelectric structural layer
Low Temperature Physical Vapor Deposition (LT-PVD)	Amorphous silicon, aluminum,titanium, titanium aluminum alloy	Structural layer for polymer-based sacrificial layers
Low Temperature Plasma Enhanced Chemical Vapor Deposition (LT-PECVD)	Amorphous silicon	Structural layer for polymer-based sacrificial layers
Plasma Enhanced Chemical Vapor Deposition (PECVD)	Amorphous silicon (phosphorus-doped), carbon rich amorphous silicon	Structural layer
Spin Coating / Annealing	Polymer thickness up to 20um / UV cure	Sacrificial layer
Atomic Layer Depostion	Aluminium Oxide (Al₂O₃)	Dielectric layer
Low Temperature Asher	Polymer	Isotropic release process
Deep Reactive Ion Etch (DRIE)	Silicon	Deep silicon etch
XeF₂ Etch	Silicon, Molybdenum, Tungsten	Isotropic release process
Front to Back Aligner	Litho tool resist up to 20um	To align the front to the back of the wafer; bulk micromachining
Electrostatic Temporary Bonder	Handling of thin wafers down to 400um	Electrostatic substrate handling system for thin wafers
Low Pressure Chemical Vapor Deposition Low Stress Nitride (LPCVD-LSN)	Silicon nitride	Structural layer
Low Stress Doped Polysilicon Deposition	Doped polysilicon	Structural layer