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Menu
About Us
Corporate Profile
Corporate Information
Corporate Social Responsibility
Semiconductor Value Chain
Our Solutions
Technology
Design Solutions
Services
Manufacturing
Manufacturing
Accreditation
Environmental, Health & Safety (EHS)
Quality and HSPM
End Markets
News
Announcements
Events
ESG
Career
Our People
Why Join Us
Vacancies
Internship Opportunities
Career Fair
Contact Us
MPW Program
MyFab
Vendor Management
DNeXPOST
MPW Program
MyFab
Vendor Management
DNeXPOST
Piezoelectric Bulk Acoustic Wave MEMS Process Platform (BAW)
BAW MEMS Key Features
Aluminum Nitride based BAW devie integrated over CMOS
Resonant Frequency >2.4GHz
Achieved maximum acoustic velocity of 10500m/sec.
7 additional mask layers to implement this on the top of the traditional CMOS devices.
Demonstrated TCF of <-30ppm/degC.
Lower insertion losses compared to SAW and ESR.
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