Piezoelectric Bulk Acoustic Wave MEMS Process Platform (BAW)

BAW MEMS Key Features

  • Aluminum Nitride based BAW devie integrated over CMOS
  • Resonant Frequency >2.4GHz
  • Achieved maximum acoustic velocity of 10500m/sec.
  • 7 additional mask layers to implement this on the top of the traditional CMOS devices.
  • Demonstrated TCF of <-30ppm/degC.
  • Lower insertion losses compared to SAW and ESR.
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