Piezoelectric Surface Acoustic Wave MEMS Process Platform (SAW)

SAW MEMS Key Features

  • Aluminum Nitride based SAW device integrated over CMOS. Archived maximum Surface acoustic velocity of 4000m/sec. Q is >3000.
  • Resonant Frequency >320 MHz
  • 4-6 additional mask layers to implement this on the top of the traditional CMOS devices.
  • Uncompensated TCF < 10 ppm/degC.
  • Unmatched Insertion loss <35dB @ 320 MHz
  • Low power consumption. Excellent for IoT and wireless based products.
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